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PIB: Parallel ion beam etching of sections collected on wafer for ultra large-scale connectomics

Ma, H.; Lv, Y.; Wang, M.; Zhao, Z.; Liu, J.; Dong, X.; Zhang, Y.; Guo, J.; Chen, B.; Zhang, L.; Chang, S.; Chen, H.; Zhai, H.; Li, L.; Chen, X.; Han, H.

2025-09-09 neuroscience
10.1101/2025.04.25.650569 bioRxiv
Show abstract

We have developed a parallel ion beam etching device enabling simultaneous 20 nm thickness reduction for hundreds of biological sections, which could be collected on a whole 4-inch wafer. Through cyclic scanning electron microscopy imaging and ion beam thinning, it is trustworthy and efficient to obtain three-dimensional volume with high axial resolution for millimeter-size samples compared to conventional volume electron microscopy methods.

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